List of AMD Ryzen processors
The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture. The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier. In addition, all support Simultaneous Multithreading (SMT) except earlier Zen/Zen+ based desktop and mobile Ryzen 3, and some models of Zen 2 based mobile Ryzen.
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List of AMD Ryzen processors
The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture. The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier. In addition, all support Simultaneous Multithreading (SMT) except earlier Zen/Zen+ based desktop and mobile Ryzen 3, and some models of Zen 2 based mobile Ryzen.
Desktop processors
Summit Ridge (1000 series, Zen based)
• Socket: AM4. • All the CPUs support DDR4-2666 in dual-channel mode. • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. • No integrated graphics. • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. • L2 cache: 512 KB per core. • Node/fabrication process: GlobalFoundries 14 LP.
<table><thead><tr><th>Branding and Model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Core config</th><th>Thermal Solution</th><th>Release date</th><th>Launch price</th></tr></thead><tbody><tr><td>Base</td><td>PBO 1–2 (≥3)</td><td>XFR 1–2</td></tr><tr><td>Ryzen 7</td><td>1800X</td><td>8 (16)</td><td>3.6</td><td>4.0 (3.7)</td><td>4.1</td><td>16 MB</td><td>95 W</td><td>2 × 4</td><td>Wraith Max</td><td>March 2, 2017</td><td>US $499</td></tr><tr><td>1700X PRO</td><td>3.4</td><td>3.8 (3.5)</td><td>3.9</td><td>—N/a</td><td>June 29, 2017</td><td>OEM</td></tr><tr><td>1700X</td><td>Wraith Max</td><td>March 2, 2017</td><td>US $399</td></tr><tr><td>1700 PRO</td><td>3.0</td><td>3.7 (3.2)</td><td>3.75</td><td>65 W</td><td>—N/a</td><td>June 29, 2017</td><td>OEM</td></tr><tr><td>1700</td><td>Wraith Spire</td><td>March 2, 2017</td><td>US $329</td></tr><tr><td>Ryzen 5</td><td>1600X</td><td>6 (12)</td><td>3.6</td><td>4.0 (3.7)</td><td>4.1</td><td>95 W</td><td>2 × 3</td><td>Wraith Max</td><td>April 11, 2017</td><td>US $249</td></tr><tr><td>1600 PRO</td><td>3.2</td><td>3.6 (3.4)</td><td>3.7</td><td>65 W</td><td>—N/a</td><td>June 29, 2017</td><td>OEM</td></tr><tr><td>1600</td><td>Wraith Stealth</td><td>April 11, 2017</td><td>US $219</td></tr><tr><td>1500X</td><td>4 (8)</td><td>3.5</td><td>3.7 (3.6)</td><td>3.9</td><td>2 × 2</td><td>Wraith Spire (No LED)</td><td>US $189</td></tr><tr><td>1500 PRO</td><td>—N/a</td><td>June 29, 2017</td><td>OEM</td></tr><tr><td>1400</td><td>3.2</td><td>3.4 (3.4)</td><td>3.45</td><td>8 MB</td><td>Wraith Stealth</td><td>April 11, 2017</td><td>US $169</td></tr><tr><td>Ryzen 3</td><td>1300X</td><td>4 (4)</td><td>3.5</td><td>3.7 (3.5)</td><td>3.9</td><td>July 27, 2017</td><td>US $129</td></tr><tr><td>1300 PRO</td><td>—N/a</td><td>June 29, 2017</td><td>OEM</td></tr><tr><td>1200 PRO</td><td>3.1</td><td>3.4 (3.1)</td><td>3.45</td></tr><tr><td>1200</td><td>Wraith Stealth</td><td>July 27, 2017</td><td>US $109</td></tr></tbody></table>
Whitehaven (Threadripper 1000 series, Zen based)
• Socket: TR4. • All the CPUs support DDR4-2666 in quad-channel mode. • All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. • No integrated graphics. • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. • L2 cache: 512 KB per core. • Node/fabrication process: GlobalFoundries 14LP.
<table><thead><tr><th>Branding and Model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Chiplets</th><th>Core config</th><th>Release date</th><th>Launch price</th></tr></thead><tbody><tr><td>Base</td><td>PBO 1–4 (≥5)</td><td>XFR 1–2</td></tr><tr><td>Ryzen Threadripper</td><td>1950X</td><td>16 (32)</td><td>3.4</td><td>4.0 (3.7)</td><td>4.2</td><td>32 MB</td><td>180 W</td><td>2 × CCD</td><td>4 × 4</td><td>August 10, 2017</td><td>US $999</td></tr><tr><td>1920X</td><td>12 (24)</td><td>3.5</td><td>4 × 3</td><td>US $799</td></tr><tr><td>1900X</td><td>8 (16)</td><td>3.8</td><td>4.0 (3.9)</td><td>16 MB</td><td>2 × 4</td><td>August 31, 2017</td><td>US $549</td></tr></tbody></table>
Raven Ridge (2000 series with Radeon Graphics, Zen/GCN5 based)
Common features of Ryzen 2000 desktop APUs:
• Socket: AM4. • All the CPUs support DDR4-2933 in dual-channel mode. • All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. • Includes integrated GCN 5th generation GPU. • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. • L2 cache: 512 KB per core. • Fabrication process: GlobalFoundries 14LP.
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th><th>Launch price</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Model</td><td>Clock (GHz)</td><td>Config</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 5</td><td>2400G</td><td>4 (8)</td><td>3.6</td><td>3.9</td><td>4 MB</td><td>RX Vega 11</td><td>1.25</td><td>704:44:16 11 CU</td><td>1760</td><td>46–65 W</td><td>February 12, 2018</td><td>US $169</td></tr><tr><td>2400GE</td><td>3.2</td><td>3.8</td><td>35 W</td><td>April 19, 2018</td><td>OEM</td></tr><tr><td>Ryzen 3</td><td>2200G</td><td>4 (4)</td><td>3.5</td><td>3.7</td><td>Vega 8</td><td>1.1</td><td>512:32:16 8 CU</td><td>1126</td><td>46–65 W</td><td>February 12, 2018</td><td>US $99</td></tr><tr><td>2200GE</td><td>3.2</td><td>3.6</td><td>35 W</td><td>April 19, 2018</td><td>OEM</td></tr><tr><td>PRO 2100GE</td><td>2 (4)</td><td>—N/a</td><td>Vega 3</td><td>1.0</td><td>192:12:4 3 CU</td><td>384</td><td>2019</td></tr></tbody></table>
Pinnacle Ridge (2000 series, Zen+ based)
• Socket: AM4. • All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E, R5 2600E, R5 1600AF and R3 1200AF which support it at DDR4-2666 speeds. • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. • No integrated graphics. • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. • L2 cache: 512 KB per core. • Fabrication process: GlobalFoundries 12LP (14LP+).
<table><thead><tr><th>Branding and Model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Core config</th><th>Thermal Solution</th><th>Release date</th><th>Launch price</th></tr></thead><tbody><tr><td>Base</td><td>PB2</td></tr><tr><td>Ryzen 7</td><td>2700X</td><td>8 (16)</td><td>3.7</td><td>4.3</td><td>16 MB</td><td>105 W</td><td>2 × 4</td><td>Wraith Prism</td><td>April 19, 2018</td><td>US $329</td></tr><tr><td>2700</td><td>3.2</td><td>4.1</td><td>65 W</td><td>Wraith Spire</td><td>US $299</td></tr><tr><td>2700E</td><td>2.8</td><td>4.0</td><td>45 W</td><td>—N/a</td><td>September 19, 2018</td><td>OEM</td></tr><tr><td>Ryzen 5</td><td>2600X</td><td>6 (12)</td><td>3.6</td><td>4.2</td><td>95 W</td><td>2 × 3</td><td>Wraith Spire</td><td>April 19, 2018</td><td>US $229</td></tr><tr><td>2600</td><td>3.4</td><td>3.9</td><td>65 W</td><td>Wraith Stealth</td><td>US $199</td></tr><tr><td>2600E</td><td>3.1</td><td>4.0</td><td>45 W</td><td>—N/a</td><td>September 19, 2018</td><td>OEM</td></tr><tr><td>1600 (AF)</td><td>3.2</td><td>3.6</td><td>65 W</td><td>Wraith Stealth</td><td>October 11, 2019</td><td>US $85</td></tr><tr><td>2500X</td><td>4 (8)</td><td>3.6</td><td>4.0</td><td>8 MB</td><td>1 × 4</td><td>—N/a</td><td>September 10, 2018</td><td>OEM</td></tr><tr><td>Ryzen 3</td><td>2300X</td><td>4 (4)</td><td>3.5</td><td>Wraith Stealth</td></tr><tr><td>1200 (AF)</td><td>3.1</td><td>3.4</td><td></td><td>April 21, 2020</td><td>US $60</td></tr></tbody></table>
Colfax (Threadripper 2000 series, Zen+ based)
• Socket: TR4. • All the CPUs support DDR4-2933 in quad-channel mode. • All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. • No integrated graphics. • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. • L2 cache: 512 KB per core. • Fabrication process: GlobalFoundries 12LP (14LP+).
<table><thead><tr><th>Branding and Model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Chiplets</th><th>Core config</th><th>Release date</th><th>Launch price</th></tr></thead><tbody><tr><td>Base</td><td>PB2</td></tr><tr><td>Ryzen Threadripper</td><td>2990WX</td><td>32 (64)</td><td>3.0</td><td>4.2</td><td>64 MB</td><td>250 W</td><td>4 × CCD</td><td>8 × 4</td><td>Aug 13, 2018</td><td>US $1799</td></tr><tr><td>2970WX</td><td>24 (48)</td><td>8 × 3</td><td>Oct 2018</td><td>US $1299</td></tr><tr><td>2950X</td><td>16 (32)</td><td>3.5</td><td>4.4</td><td>32 MB</td><td>180 W</td><td>2 × CCD</td><td>4 × 4</td><td>Aug 31, 2018</td><td>US $899</td></tr><tr><td>2920X</td><td>12 (24)</td><td>4.3</td><td>4 × 3</td><td>Oct 2018</td><td>US $649</td></tr></tbody></table>
Picasso (3000 series with Radeon Graphics, Zen+/GCN5 based)
• Socket: AM4. • All the CPUs support DDR4-2933 in dual-channel mode. • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs provide 20 PCIe 3.0, from which 4 are reserved as link to the chipset. • Includes integrated GCN 5th generation GPU. • Fabrication process: GlobalFoundries 12LP (14LP+).
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Model</td><td>Clock (GHz)</td><td>Config</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 5</td><td>PRO 3400G</td><td>4 (8)</td><td>3.7</td><td>4.2</td><td>4 MB</td><td>Radeon RX Vega 11</td><td>1.4</td><td>704:44:8 11 CU</td><td>1971.2</td><td>65 W</td><td>Sep 30, 2019</td><td>OEM</td></tr><tr><td>3400G</td><td>Jul 7, 2019</td><td>US $149</td></tr><tr><td>PRO 3400GE</td><td>3.3</td><td>4.0</td><td>1.3</td><td>1830.4</td><td>35 W</td><td>Sep 30, 2019</td><td>OEM</td></tr><tr><td>PRO 3350G</td><td>3.6</td><td>Radeon Vega 10</td><td>640:40:8 10 CU</td><td>1664</td><td>65 W</td><td>Jul 21, 2020</td></tr><tr><td>PRO 3350GE</td><td>4 (4)</td><td>3.3</td><td>3.9</td><td>1.2</td><td>1536</td><td>35 W</td></tr><tr><td>Ryzen 3</td><td>PRO 3200G</td><td>3.6</td><td>4.0</td><td>Radeon Vega 8</td><td>1.25</td><td>512:32:8 8 CU</td><td>1280</td><td>65 W</td><td>Sep 30, 2019</td></tr><tr><td>3200G</td><td>Jul 7, 2019</td><td>US $99</td></tr><tr><td>3200GE</td><td>3.3</td><td>3.8</td><td>1.2</td><td>1228.8</td><td>35 W</td><td>Jul 7, 2019</td><td>OEM</td></tr><tr><td>PRO 3200GE</td><td>Sep 30, 2019</td></tr></tbody></table>
Matisse (3000 series, Zen 2 based)
• Socket: AM4. • All the CPUs support DDR4-3200 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 24 PCIe 4.0 lanes. 4 of which are reserved as link to the chipset. • No integrated graphics. • Fabrication process: TSMC 7FF.
<table><thead><tr><th>Branding and Model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Chiplets</th><th>Core config</th><th>Thermal Solution</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>3950X</td><td>16 (32)</td><td>3.5</td><td>4.7</td><td>64 MB</td><td>105 W</td><td>2 × CCD 1 × I/OD</td><td>4 × 4</td><td>—N/a</td><td>Nov 25, 2019</td><td>US $749</td></tr><tr><td>3900XT</td><td>12 (24)</td><td>3.8</td><td>4 × 3</td><td>Jul 7, 2020</td><td>US $499</td></tr><tr><td>3900X</td><td>4.6</td><td>Wraith Prism</td><td>Jul 7, 2019</td></tr><tr><td>3900</td><td>3.1</td><td>4.3</td><td>65 W</td><td>—N/a</td><td>Oct 8, 2019</td><td>OEM</td></tr><tr><td>Ryzen 7</td><td>3800XT</td><td>8 (16)</td><td>3.9</td><td>4.7</td><td>32 MB</td><td>105 W</td><td>1 × CCD 1 × I/OD</td><td>2 × 4</td><td>—N/a</td><td>Jul 7, 2020</td><td>US $399</td></tr><tr><td>3800X</td><td>4.5</td><td>Wraith Prism</td><td>Jul 7, 2019</td></tr><tr><td>3700X</td><td>3.6</td><td>4.4</td><td>065 W</td><td>US $329</td></tr><tr><td>Ryzen 5</td><td>3600XT</td><td>6 (12)</td><td>3.8</td><td>4.5</td><td>95 W</td><td>2 × 3</td><td>—N/a</td><td>Jul 7, 2020</td><td>US $249</td></tr><tr><td>3600X</td><td>4.4</td><td>Wraith Spire (non-LED)</td><td>Jul 7, 2019</td></tr><tr><td>3600</td><td>3.6</td><td>4.2</td><td>65 W</td><td>Wraith Stealth</td><td>US $199</td></tr><tr><td>3500X</td><td>6 (6)</td><td>4.1</td><td>Oct 8, 2019</td><td>CNY 1099 (Mainland China Only)</td></tr><tr><td>3500</td><td>16 MB</td><td>—N/a</td><td>Nov 15, 2019</td><td>OEM (Worldwide) JPY 16000 (Japan Only)</td></tr><tr><td>Ryzen 3</td><td>3300X</td><td>4 (8)</td><td>3.8</td><td>4.3</td><td>1 × 4</td><td>Wraith Stealth</td><td>Apr 21, 2020</td><td>US $119</td></tr><tr><td>3100</td><td>3.6</td><td>3.9</td><td>2 × 2</td><td>US $99</td></tr></tbody></table>
Castle Peak (Threadripper 3000 series, Zen 2 based)
Common features of Ryzen 3000 HEDT/workstation CPUs:
• Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO). • Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset. • No integrated graphics. • Fabrication process: TSMC 7FF.
<table><thead><tr><th>Branding and Model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Chiplets</th><th>Core config</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen Threadripper PRO</td><td>3995WX</td><td>64 (128)</td><td>2.7</td><td>4.2</td><td>256 MB</td><td>280 W</td><td>8 × CCD 1 × I/OD</td><td>16 × 4</td><td>Jul 14, 2020</td><td></td></tr><tr><td>3975WX</td><td>32 (64)</td><td>3.5</td><td>128 MB</td><td>4 × CCD 1 × I/OD</td><td>8 × 4</td><td></td></tr><tr><td>3955WX</td><td>16 (32)</td><td>3.9</td><td>4.3</td><td>64 MB</td><td>2 × CCD 1 × I/OD</td><td>4 × 4</td><td></td></tr><tr><td>3945WX</td><td>12 (24)</td><td>4.0</td><td>4 × 3</td><td></td></tr><tr><td>Ryzen Threadripper</td><td>3990X</td><td>64 (128)</td><td>2.9</td><td>256 MB</td><td>8 × CCD 1 × I/OD</td><td>16 × 4</td><td>Feb 7, 2020</td><td>US $3990</td></tr><tr><td>3970X</td><td>32 (64)</td><td>3.7</td><td>4.5</td><td>128 MB</td><td>4 × CCD 1 × I/OD</td><td>8 × 4</td><td>Nov 25, 2019</td><td>US $1999</td></tr><tr><td>3960X</td><td>24 (48)</td><td>3.8</td><td>8 × 3</td><td>US $1399</td></tr></tbody></table>
Renoir (4000 series, Zen 2 based)
Based on the Ryzen 4000G series APUs with the integrated GPU disabled. Common features of Ryzen 4000 desktop CPUs:
• Socket: AM4. • The AMD 4700S uses the BGA 2197 socket and the 4800S uses BGA 2963. • All the CPUs support DDR4-3200 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. • No integrated graphics. • Fabrication process: TSMC 7FF. • Bundled with AMD Wraith Stealth
The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.
<table><thead><tr><th>Branding and model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Core config</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>AMD</td><td>4800S</td><td>8 (16)</td><td></td><td>4.0</td><td>8 MB</td><td></td><td>2 × 4</td><td>2022</td><td>bundled with desktop kit</td></tr><tr><td>4700S</td><td>3.6</td><td>75 W</td><td>2021</td></tr><tr><td>Ryzen 5</td><td>4500</td><td>6 (12)</td><td>4.1</td><td>65 W</td><td>2 × 3</td><td>Apr 4, 2022</td><td>US $129</td></tr><tr><td>Ryzen 3</td><td>4100</td><td>4 (8)</td><td>3.8</td><td>4.0</td><td>4 MB</td><td>1 × 4</td><td>US $99</td></tr></tbody></table>
Renoir (4000 series with Radeon Graphics, Zen 2/GCN5.1 based)
• Socket: AM4. • All the CPUs support DDR4-3200 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. • Includes integrated GCN 5th generation GPU. • Fabrication process: TSMC 7FF.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th><th>Release price</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core Config</td><td>Model</td><td>Clock (GHz)</td><td>Config</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 7</td><td>4700G</td><td>8 (16)</td><td>3.6</td><td>4.4</td><td>8 MB</td><td>2 × 4</td><td>Radeon Graphics</td><td>2.1</td><td>512:32:16 8 CU</td><td>2150.4</td><td>65 W</td><td>Jul 21, 2020</td><td>OEM</td></tr><tr><td>4700GE</td><td>3.1</td><td>4.3</td><td>2.0</td><td>2048</td><td>35 W</td></tr><tr><td>Ryzen 5</td><td>4600G</td><td>6 (12)</td><td>3.7</td><td>4.2</td><td>2 × 3</td><td>1.9</td><td>448:28:14 7 CU</td><td>1702.4</td><td>65 W</td><td>Jul 21, 2020 (OEM) Apr 4, 2022 (retail)</td><td>US $154</td></tr><tr><td>4600GE</td><td>3.3</td><td>35 W</td><td>Jul 21, 2020</td><td>OEM</td></tr><tr><td>Ryzen 3</td><td>4300G</td><td>4 (8)</td><td>3.8</td><td>4.0</td><td>4 MB</td><td>1 × 4</td><td>1.7</td><td>384:24:12 6 CU</td><td>1305.6</td><td>65 W</td></tr><tr><td>4300GE</td><td>3.5</td><td>35 W</td></tr></tbody></table>
Vermeer (5000 series, Zen 3 based)
• Socket: AM4. • All the CPUs support DDR4-3200 in dual-channel mode. • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset. • No integrated graphics. • L1 cache: 64 KB per core (32 KB data + 32 KB instruction). • L2 cache: 512 KB per core. • Fabrication process: TSMC 7FF.
<table><thead><tr><th>Branding and model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Chiplets</th><th>Core config</th><th>Thermal solution</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>5950X</td><td>16 (32)</td><td>3.4</td><td>4.9</td><td>64 MB</td><td>105 W</td><td>2 × CCD 1 × I/OD</td><td>2 × 8</td><td>—N/a</td><td>Nov 5, 2020</td><td>US $799</td></tr><tr><td>5900XT</td><td>3.3</td><td>4.8</td><td>Jul 31, 2024</td><td>US $349</td></tr><tr><td>5900X</td><td>12 (24)</td><td>3.7</td><td>2 × 6</td><td>Nov 5, 2020</td><td>US $549</td></tr><tr><td>5900</td><td>3.0</td><td>4.7</td><td>65 W</td><td>Jan 12, 2021</td><td>OEM</td></tr><tr><td>PRO 5945</td><td>Sep 2022</td></tr><tr><td>Ryzen 7</td><td>5800X3D</td><td>8 (16)</td><td>3.4</td><td>4.5</td><td>96 MB</td><td>105 W</td><td>1 × CCD 1 × I/OD</td><td>1 × 8</td><td>Apr 20, 2022</td><td>US $449</td></tr><tr><td>5800XT</td><td>3.8</td><td>4.8</td><td>32 MB</td><td>Wraith Prism, None</td><td>Jul 31, 2024</td><td>US $249</td></tr><tr><td>5800X</td><td>4.7</td><td>—N/a</td><td>Nov 5, 2020</td><td>US $449</td></tr><tr><td>5800</td><td>3.4</td><td>4.6</td><td>65 W</td><td>Jan 12, 2021</td><td>OEM</td></tr><tr><td>5700X3D</td><td>3.0</td><td>4.1</td><td>96 MB</td><td>105 W</td><td>Jan 31, 2024</td><td>US $249</td></tr><tr><td>5700X</td><td>3.4</td><td>4.6</td><td>32 MB</td><td>65 W</td><td>Apr 4, 2022</td><td>US $299</td></tr><tr><td>PRO 5845</td><td>Sep 2022</td><td>OEM</td></tr><tr><td>Ryzen 5</td><td>5600X3D</td><td>6 (12)</td><td>3.3</td><td>4.4</td><td>96 MB</td><td>105 W</td><td>1 × 6</td><td>Jul 7, 2023</td><td>US $229 US Only</td></tr><tr><td>5600XT</td><td>3.7</td><td>4.7</td><td>32 MB</td><td>65 W</td><td>Wraith Stealth</td><td>Oct 31, 2024</td><td>US $194</td></tr><tr><td>5600X</td><td>3.7</td><td>4.6</td><td>Nov 5, 2020</td><td>US $299</td></tr><tr><td>5600T</td><td>3.5</td><td>4.5</td><td>Oct 31, 2024</td><td>US $186</td></tr><tr><td>5600</td><td>3.5</td><td>4.4</td><td>Apr 4, 2022</td><td>US $199</td></tr><tr><td>5600F</td><td>3.0</td><td>4.0</td><td>Sep 16, 2025</td><td>APJ Only</td></tr><tr><td>PRO 5645</td><td>3.7</td><td>4.6</td><td>—N/a</td><td>Sep 2022</td><td>OEM</td></tr><tr><td>5500X3D</td><td>3.0</td><td>4.0</td><td>96 MB</td><td>105 W</td><td>Jun 5, 2025</td><td>LATAM Only</td></tr></tbody></table>
Cezanne (5000 series, Zen 3 based)
Cézanne based CPUs that have the integrated GPU disabled. Common features of Ryzen 5000 (Cezanne) desktop CPUs:
• Socket: AM4. • CPUs support DDR4-3200 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. • No integrated graphics. • Fabrication process: TSMC 7FF.
<table><thead><tr><th>Branding and model</th><th>Cores (threads)</th><th>Thermal solution</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Core config</th><th>Release date</th><th>MSRP (USD)</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 7</td><td>5700</td><td>8 (16)</td><td>Wraith Stealth</td><td>3.7</td><td>4.6</td><td>16 MB</td><td>65 W</td><td>1 × 8</td><td>Apr 4, 2022 (OEM), Dec 21, 2023 (retail)</td><td>$179</td></tr><tr><td>Ryzen 5</td><td>5500</td><td>6 (12)</td><td>3.6</td><td>4.2</td><td>1 × 6</td><td>Apr 4, 2022</td><td>$159</td></tr><tr><td>Ryzen 3</td><td>5100</td><td>4 (8)</td><td>–</td><td>3.8</td><td>8 MB</td><td>1 × 4</td><td>2023</td><td>OEM</td></tr></tbody></table>
Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5.1 based)
• Socket: AM4. • All the CPUs support DDR4-3200 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. • Includes integrated GCN 5th generation GPU. • Fabrication process: TSMC 7FF.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>Thermal solution</th><th>TDP</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Clock (MHz)</td><td>Config</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 7</td><td>5705G</td><td>8 (16)</td><td>3.8</td><td>4.6</td><td>16 MB</td><td>1 × 8</td><td>2000</td><td>512:32:8 8 CU</td><td>2048</td><td>—N/a</td><td>65 W</td><td></td><td></td></tr><tr><td>5700G</td><td>Wraith Stealth</td><td>Apr 13, 2021 (OEM), Aug 5, 2021 (retail)</td><td>US $359</td></tr><tr><td>5705GE</td><td>3.2</td><td>—N/a</td><td>35 W</td><td></td><td></td></tr><tr><td>5700GE</td><td>Wraith Stealth</td><td>Apr 13, 2021</td><td>OEM</td></tr><tr><td>Ryzen 5</td><td>5600GT</td><td>6 (12)</td><td>3.6</td><td>1 × 6</td><td>1900</td><td>448:28:8 7 CU</td><td>1702.4</td><td>65 W</td><td>Jan 31, 2024</td><td>US $140</td></tr><tr><td>5605G</td><td>3.9</td><td>4.4</td><td>—N/a</td><td></td><td></td></tr><tr><td>5600G</td><td>Wraith Stealth</td><td>Apr 13, 2021 (OEM), Aug 5, 2021 (retail)</td><td>US $259</td></tr><tr><td>5605GE</td><td>3.4</td><td>—N/a</td><td>35 W</td><td></td><td></td></tr><tr><td>5600GE</td><td>Wraith Stealth</td><td>Apr 13, 2021</td><td>OEM</td></tr><tr><td>5500GT</td><td>3.6</td><td>65 W</td><td>Jan 31, 2024</td><td>US $125</td></tr><tr><td>Ryzen 3</td><td>5305G</td><td>4 (8)</td><td>4.0</td><td>4.2</td><td>8 MB</td><td>1 × 4</td><td>1700</td><td>384:24:8 6 CU</td><td>1305.6</td><td>—N/a</td><td></td><td></td></tr><tr><td>5300G</td><td>OEM</td><td>Apr 13, 2021</td><td>OEM</td></tr><tr><td>5305GE</td><td>3.6</td><td>—N/a</td><td>35 W</td><td></td><td></td></tr><tr><td>5300GE</td><td>OEM</td><td>Apr 13, 2021</td><td>OEM</td></tr></tbody></table>
Chagall (Threadripper 5000 series, Zen 3 based)
• Socket: sWRX8. • All the CPUs support DDR4-3200 in octa-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset. • No integrated graphics. • Fabrication process: TSMC 7FF.
<table><thead><tr><th>Branding and Model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Chiplets</th><th>Core config</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen Threadripper PRO</td><td>5995WX</td><td>64 (128)</td><td>2.7</td><td>4.5</td><td>256 MB</td><td>280 W</td><td>8 × CCD 1 × I/OD</td><td>8 × 8</td><td>Mar 8, 2022 (OEM) / ? (retail)</td><td>OEM / US $6500</td></tr><tr><td>5975WX</td><td>32 (64)</td><td>3.6</td><td>128 MB</td><td>4 × CCD 1 × I/OD</td><td>4 × 8</td><td>Mar 8, 2022 (OEM) / ? (retail)</td><td>OEM / US $3300</td></tr><tr><td>5965WX</td><td>24 (48)</td><td>3.8</td><td>4 × 6</td><td>Mar 8, 2022 (OEM) / ? (retail)</td><td>OEM / US $2400</td></tr><tr><td>5955WX</td><td>16 (32)</td><td>4.0</td><td>64 MB</td><td>2 × CCD 1 × I/OD</td><td>2 × 8</td><td>Mar 8, 2022</td><td>OEM</td></tr><tr><td>5945WX</td><td>12 (24)</td><td>4.1</td><td>2 × 6</td></tr></tbody></table>
Raphael (7000 series, Zen 4/RDNA2 based)
• Socket: AM5. • All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R. • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset. • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost). Models with "F" suffixes are without iGPUs. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
<table><thead><tr><th>Branding and model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>Chiplets</th><th>Core config</th><th>TDP</th><th>Thermal solution</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>7950X3D</td><td>16 (32)</td><td>4.2</td><td>5.7</td><td>128 MB</td><td>2 × CCD 1 × I/OD</td><td>2 × 8</td><td>120 W</td><td>—N/a</td><td>Feb 28, 2023</td><td>US $699</td></tr><tr><td>7950X</td><td>4.5</td><td>64 MB</td><td>170 W</td><td>Sep 27, 2022</td></tr><tr><td>7900X3D</td><td>12 (24)</td><td>4.4</td><td>5.6</td><td>128 MB</td><td>2 × 6</td><td>120 W</td><td>Feb 28, 2023</td><td>US $599</td></tr><tr><td>7900X</td><td>4.7</td><td>64 MB</td><td>170 W</td><td>Sep 27, 2022</td><td>US $549</td></tr><tr><td>7900</td><td>3.7</td><td>5.4</td><td>65 W</td><td>Wraith Prism, None</td><td>Jan 10, 2023</td><td>US $429</td></tr><tr><td>PRO 7945</td><td>Wraith Spire, Wraith Stealth</td><td>Jun 13, 2023</td><td>OEM</td></tr><tr><td>Ryzen 7</td><td>7800X3D</td><td>8 (16)</td><td>4.2</td><td>5.0</td><td>96 MB</td><td>1 × CCD 1 × I/OD</td><td>1 × 8</td><td>120 W</td><td>—N/a</td><td>Apr 6, 2023</td><td>US $449</td></tr><tr><td>7700X</td><td>4.5</td><td>5.4</td><td>32 MB</td><td>105 W</td><td>Sep 27, 2022</td><td>US $399</td></tr><tr><td>7700</td><td>3.8</td><td>5.3</td><td>65 W</td><td>Wraith Prism, None</td><td>Jan 10, 2023</td><td>US $329</td></tr><tr><td>PRO 7745</td><td>Wraith Spire, Wraith Stealth</td><td>Jun 13, 2023</td><td>OEM</td></tr><tr><td>Ryzen 5</td><td>7600X3D</td><td>6 (12)</td><td>4.1</td><td>4.7</td><td>96 MB</td><td>1 × 6</td><td>—N/a</td><td>Aug 31, 2024</td><td>US $299</td></tr><tr><td>7600X</td><td>4.7</td><td>5.3</td><td>32 MB</td><td>105 W</td><td>Sep 27, 2022</td></tr><tr><td>7600</td><td>3.8</td><td>5.1</td><td>65 W</td><td>Wraith Stealth</td><td>Jan 10, 2023</td><td>US $229</td></tr><tr><td>PRO 7645</td><td>Wraith Spire, Wraith Stealth</td><td>Jun 13, 2023</td><td>OEM</td></tr><tr><td>7500X3D</td><td>4.0</td><td>4.5</td><td>96 MB</td><td>—N/a</td><td>Nov 12, 2025</td><td>OEM</td></tr><tr><td>7500F</td><td>3.7</td><td>5.0</td><td>32 MB</td><td>Wraith Stealth</td><td>Jul 22, 2023</td><td>US $179</td></tr><tr><td>7400F</td><td>4.7</td><td>Jan 9, 2025</td><td>CNY 849 (Mainland China) APJ Only</td></tr><tr><td>7400</td><td>3.3</td><td>4.3</td><td>16 MB</td><td>Sep 16, 2025</td><td>TBA</td></tr></tbody></table>
Storm Peak (Threadripper 7000 series, Zen 4 based)
Common features of Ryzen 7000 HEDT/workstation CPUs:
• Socket: sTR5. • Threadripper CPUs support DDR5-5200 in quad-channel mode while Threadripper PRO CPUs support DDR5-5200 in octa-channel mode with ECC support. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • Threadripper CPUs support 48 PCIe 5.0 and 24 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 5.0 lanes. In addition, all processor models have 4 PCIe 4.0 lanes reserved as link to the chipset. • No integrated graphics. • Fabrication process: TSMC 5FF.
<table><thead><tr><th>Branding and model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Chiplets</th><th>Core config</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen Threadripper PRO</td><td>7995WX</td><td>96 (192)</td><td>2.5</td><td>5.1</td><td>384 MB</td><td>350 W</td><td>12 × CCD 1 × I/OD</td><td>12 × 8</td><td>Nov 21, 2023</td><td>US $9999</td></tr><tr><td>7985WX</td><td>64 (128)</td><td>3.2</td><td>256 MB</td><td>8 × CCD 1 × I/OD</td><td>8 × 8</td><td>US $7349</td></tr><tr><td>7975WX</td><td>32 (64)</td><td>4.0</td><td>5.3</td><td>128 MB</td><td>4 × CCD 1 × I/OD</td><td>4 × 8</td><td>US $3899</td></tr><tr><td>7965WX</td><td>24 (48)</td><td>4.2</td><td>4 × 6</td><td>US $2649</td></tr><tr><td>7955WX</td><td>16 (32)</td><td>4.5</td><td>64 MB</td><td>2 × CCD 1 × I/OD</td><td>2 × 8</td><td>US $1899</td></tr><tr><td>7945WX</td><td>12 (24)</td><td>4.7</td><td>2 × 6</td><td>US $1399</td></tr><tr><td>Ryzen Threadripper</td><td>7980X</td><td>64 (128)</td><td>3.2</td><td>5.1</td><td>256 MB</td><td>8 × CCD 1 × I/OD</td><td>8 × 8</td><td>US $4999</td></tr><tr><td>7970X</td><td>32 (64)</td><td>4.0</td><td>5.3</td><td>128 MB</td><td>4 × CCD 1 × I/OD</td><td>4 × 8</td><td>US $2499</td></tr><tr><td>7960X</td><td>24 (48)</td><td>4.2</td><td>4 × 6</td><td>US $1499</td></tr></tbody></table>
Phoenix (8000 series, Zen 4 based)
• Socket: AM5. • All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • All the CPUs support 20 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset. • No integrated graphics. • Fabrication process: TSMC 4 nm FinFET.
<table><thead><tr><th>Branding and model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>NPU</th><th>TDP</th><th>Core config</th><th>Thermal solution</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 7</td><td>8700F</td><td>8 (16)</td><td>4.1</td><td>5.0</td><td>16 MB</td><td>Partial</td><td>65 W</td><td>1 × 8</td><td>Wraith Stealth</td><td>April 1, 2024</td><td>OEM</td></tr><tr><td>Ryzen 5</td><td>8400F</td><td>6 (12)</td><td>4.2</td><td>4.7</td><td>No</td><td>1 × 6</td></tr></tbody></table>
Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)
• Socket: AM5. • All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset. • Includes integrated RDNA 3 GPU. • Includes XDNA AI Engine (Ryzen AI) on models without Zen 4c cores. • Fabrication process: TSMC 4 nm FinFET.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>NPU</th><th>TDP</th><th>Thermal solution</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Core config</td><td>Clock (GHz)</td></tr><tr><td>Total</td><td>Zen 4</td><td>Zen 4c</td><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 7</td><td>8700G</td><td>8 (16)</td><td>8 (16)</td><td>—N/a</td><td>4.2</td><td>5.1</td><td>16 MB</td><td>1 × 8</td><td>780M</td><td>12 CUs 768:48:24:12</td><td>2.9</td><td>Ryzen AI Up to 16 TOPS</td><td>65 W</td><td>Wraith Spire (before Aug 1, 2025) Wraith Stealth (since Aug 1, 2025)</td><td>Jan 31, 2024</td><td>US $329</td></tr><tr><td>PRO 8700GE</td><td>3.6</td><td>2.7</td><td>35 W</td><td>—N/a</td><td>Apr 16, 2024</td><td>US $299</td></tr><tr><td>Ryzen 5</td><td>8600G</td><td>6 (12)</td><td>6 (12)</td><td>4.3</td><td>5.0</td><td>1 × 6</td><td>760M</td><td>8 CUs 512:32:16:8</td><td>2.8</td><td>65 W</td><td>Wraith Stealth</td><td>Jan 31, 2024</td><td>US $229</td></tr><tr><td>PRO 8600GE</td><td>3.9</td><td>2.6</td><td>35 W</td><td>—N/a</td><td>Apr 16, 2024</td><td>OEM</td></tr><tr><td>8500G</td><td>2 (4)</td><td>4 (8)</td><td>4.1 / 3.2</td><td>5.0 / 3.7</td><td>2 + 4</td><td>740M</td><td>4 CUs 256:16:8:4</td><td>2.8</td><td>No</td><td>65 W</td><td>Wraith Stealth</td><td>Jan 31, 2024</td><td>US $179</td></tr><tr><td>8500GE</td><td>3.9 / 3.1</td><td>35 W</td><td>—N/a</td><td>Apr 16, 2024</td><td>OEM</td></tr><tr><td>Ryzen 3</td><td>8300G</td><td>4 (8)</td><td>1 (2)</td><td>3 (6)</td><td>4.0 / 3.2</td><td>4.9 / 3.6</td><td>8 MB</td><td>1 + 3</td><td>2.6</td><td>65 W</td><td>Wraith Stealth</td><td>Jan 2024 (OEM) / Q1 2024 (retail)</td><td>OEM / TBA</td></tr><tr><td>8300GE</td><td>35 W</td><td>—N/a</td><td>Apr 16, 2024</td><td>OEM</td></tr></tbody></table>
Granite Ridge (9000 series, Zen 5/RDNA2 based)
• Socket: AM5. • All the CPUs support DDR5-5600 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R. • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset. • Includes integrated RDNA 2 GPU with 2 CUs and base and boost clock speeds of 0.4 GHz and 2.2 GHz, respectively. Models with "F" suffixes are without iGPUs. • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • Models with an "X3D" suffix include 2nd-generation 3D V-Cache in the form of a 64 MB cache die, which augments the L3 cache of one CCD. • Fabrication process: TSMC N4X FinFET (N6 FinFET for the I/O die).
<table><thead><tr><th>Branding and Model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Chiplets</th><th>Core config</th><th>Thermal solution</th><th>Release date</th><th>Launch MSRP</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>9950X3D2</td><td>16 (32)</td><td>4.3</td><td>5.6</td><td>192 MB</td><td>200 W</td><td>2 × CCD 1 × I/OD</td><td>2 × 8</td><td>—N/a</td><td>TBA</td></tr><tr><td>9950X3D</td><td>5.7</td><td>128 MB</td><td>170 W</td><td>March 12, 2025</td><td>US $699</td></tr><tr><td>9950X</td><td>64 MB</td><td>August 15, 2024</td><td>US $649</td></tr><tr><td>9900X3D</td><td>12 (24)</td><td>4.4</td><td>5.5</td><td>128 MB</td><td>120 W</td><td>2 × 6</td><td>March 12, 2025</td><td>US $599</td></tr><tr><td>9900X</td><td>5.6</td><td>64 MB</td><td>August 15, 2024</td><td>US $499</td></tr><tr><td>Ryzen 7</td><td>9850X3D</td><td>8 (16)</td><td>4.7</td><td>96 MB</td><td>1 × CCD 1 × I/OD</td><td>1 × 8</td><td>January 29, 2026</td><td>US $499</td></tr><tr><td>9800X3D</td><td>5.2</td><td>November 7, 2024</td><td>US $479</td></tr><tr><td>9700X</td><td>3.8</td><td>5.5</td><td>32 MB</td><td>65 W</td><td>August 8, 2024</td><td>US $359</td></tr><tr><td>9700F</td><td>65 W</td><td>September 16, 2025</td><td>TBA</td></tr><tr><td>Ryzen 5</td><td>9600X</td><td>6 (12)</td><td>3.9</td><td>5.4</td><td>65 W</td><td>1 × 6</td><td>August 8, 2024</td><td>US $279</td></tr><tr><td>9600</td><td>3.8</td><td>5.2</td><td>65 W</td><td>Wraith Stealth</td><td>February 19, 2025</td><td>TBA</td></tr><tr><td>9500F</td><td>5.0</td><td>September 16, 2025</td><td>CN ¥1,299</td></tr></tbody></table>
Shimada Peak (Threadripper 9000 series, Zen 5 based)
Common features of Ryzen 9000 HEDT/workstation CPUs:
• Socket: sTR5. • Threadripper CPUs support DDR5-6400 in quad-channel mode while Threadripper PRO CPUs support DDR5-6400 in octa-channel mode with ECC support. • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • Threadripper CPUs support 80 PCIe 5.0 lanes (4 of which runs PCIe 4.0 mode to the chipset; and remaining are usually running as 48 PCIe 5.0 lanes plus 24 PCIe 4.0 lanes), while Threadripper PRO CPUs support 128 PCIe 5.0 lanes (4 of which runs in PCIe 4.0 mode to the chipset), and extra 8 PCIe 3.0 lanes. Some lanes support alternative mode of running SATA3. • No integrated graphics. • Fabrication process: TSMC 4nm FinFET.
<table><thead><tr><th>Branding and model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>TDP</th><th>Chiplets</th><th>Core config</th><th>Release date</th><th>MSRP</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen Threadripper PRO</td><td>9995WX</td><td>96 (192)</td><td>2.5</td><td>5.4</td><td>384 MB</td><td>350 W</td><td>12 × CCD 1 × I/OD</td><td>12 × 8</td><td>July 2025</td><td>$11,699</td></tr><tr><td>9985WX</td><td>64 (128)</td><td>3.2</td><td>256 MB</td><td>8 × CCD 1 × I/OD</td><td>8 × 8</td><td>$7,999</td></tr><tr><td>9975WX</td><td>32 (64)</td><td>4.0</td><td>128 MB</td><td>4 × CCD 1 × I/OD</td><td>4 × 8</td><td>$4,099</td></tr><tr><td>9965WX</td><td>24 (48)</td><td>4.2</td><td>4 × 6</td><td>$2,899</td></tr><tr><td>9955WX</td><td>16 (32)</td><td>4.5</td><td>64 MB</td><td>2 × CCD 1 × I/OD</td><td>2 × 8</td><td>$1,649</td></tr><tr><td>9945WX</td><td>12 (24)</td><td>4.7</td><td>2 × 6</td><td>OEM</td></tr><tr><td>Ryzen Threadripper</td><td>9980X</td><td>64 (128)</td><td>3.2</td><td>256 MB</td><td>8 × CCD 1 × I/OD</td><td>8 × 8</td><td>$4,999</td></tr><tr><td>9970X</td><td>32 (64)</td><td>4.0</td><td>128 MB</td><td>4 × CCD 1 × I/OD</td><td>4 × 8</td><td>$2,499</td></tr><tr><td>9960X</td><td>24 (48)</td><td>4.2</td><td>4 × 6</td><td>$1,499</td></tr></tbody></table>
Gorgon Point AM5 (AI 400 Series, Zen 5/RDNA3.5/XDNA2 based)
• Socket: AM5. • All the CPUs support DDR5-5600 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R. • L2 cache: 80 KB per core. • L2 cache: 1 MB per core. • Includes integrated RDNA 3.5 GPU. • Includes XDNA 2 AI Engine (Ryzen AI). • Fabrication process: TSMC 4 nm FinFET.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>NPU (Ryzen AI)</th><th>TDP</th><th>Release</th><th>MSRP</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache</td></tr><tr><td>Base</td><td>Boost</td><td>Model</td><td>Cores</td><td>Clock (GHz)</td></tr><tr><td>Ryzen AI 7 450G</td><td>8 (16)</td><td>2.0</td><td>5.1</td><td>16 MB</td><td>Radeon 860M</td><td>8</td><td>3.1</td><td>Up to 50 TOPS</td><td>65 W</td><td>March 2, 2026 (OEM)</td><td>OEM</td></tr><tr><td>Ryzen AI 7 450GE</td><td>35 W</td></tr><tr><td>Ryzen AI 5 440G</td><td>6 (12)</td><td>4.8</td><td>16 MB</td><td>Radeon 840M</td><td>4</td><td>2.9</td><td>65 W</td></tr><tr><td>Ryzen AI 5 440GE</td><td>35 W</td></tr><tr><td>Ryzen AI 5 435G</td><td>4.5</td><td>8 MB</td><td>2.8</td><td>65 W</td></tr><tr><td>Ryzen AI 5 435GE</td><td>35 W</td></tr></tbody></table>
Mobile processors
Raven Ridge (Zen/GCN5 based)
• Socket: FP5. • The U-series CPUs support DDR4-2400 in dual-channel mode, while the H-series CPUs support it at DDR4-3200 speeds. • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 12 PCIe 3.0 lanes. • Includes integrated GCN 5th generation GPU. • Fabrication process: GlobalFoundries 14LP.
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Config</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 7</td><td>2800H</td><td>4 (8)</td><td>3.3</td><td>3.8</td><td>4 MB</td><td>1 × 4</td><td>RX Vega 11</td><td>1.3</td><td>704:44:16 11 CUs</td><td>1830.4</td><td>35–54 W</td><td>Sep 10, 2018</td></tr><tr><td>2700U</td><td>2.2</td><td>RX Vega 10</td><td>640:40:16 10 CUs</td><td>1664</td><td>12–25 W</td><td>Oct 26, 2017</td></tr><tr><td>Ryzen 5</td><td>2600H</td><td>3.2</td><td>3.6</td><td>Vega 8</td><td>1.1</td><td>512:32:16 8 CUs</td><td>1126.4</td><td>35–54 W</td><td>Sep 10, 2018</td></tr><tr><td>2500U</td><td>2.0</td><td>12–25 W</td><td>Oct 26, 2017</td></tr><tr><td>Ryzen 3</td><td>2300U</td><td>4 (4)</td><td>3.4</td><td>Vega 6</td><td>384:24:8 6 CUs</td><td>844.8</td><td>Jan 8, 2018</td></tr><tr><td>2200U</td><td>2 (4)</td><td>2.5</td><td>1 × 2</td><td>Vega 3</td><td>192:12:4 3 CUs</td><td>422.4</td></tr></tbody></table>
Dalí (Zen/GCN5 based)
• Socket: FP5. • All the CPUs support DDR4-2400 in dual-channel mode. • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. • L2 cache: 512 KB per core. • All these CPUs provide 12 PCIe 3.0 lanes. 4 are reserved as link to the chipset. • Includes integrated GCN 5th generation GPU. • Fabrication process: GlobalFoundries 14LP.
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Config</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 3</td><td>3250U</td><td>2 (4)</td><td>2.6</td><td>3.5</td><td>4 MB</td><td>1 × 2</td><td>Vega 3</td><td>1.2</td><td>192:12:4 3 CUs</td><td>460.8</td><td>12–25 W</td><td>Jan 6, 2020</td></tr><tr><td>3250C</td><td>Sep 22, 2020</td></tr><tr><td>3200U</td><td>Jan 6, 2019</td></tr></tbody></table>
Picasso (Zen+/GCN5 based)
• Socket: FP5. • All the CPUs support DDR4-2400 in dual-channel mode. • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 16 PCIe 3.0 lanes. • Includes integrated GCN 5th generation GPU. • Fabrication process: GlobalFoundries 12LP (14LP+).
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Config</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 7</td><td>3780U</td><td>4 (8)</td><td>2.3</td><td>4.0</td><td>4 MB</td><td>1 × 4</td><td>RX Vega 11</td><td>1.4</td><td>704:44:16 11 CU</td><td>1971.2</td><td>15 W</td><td>Oct 2019</td></tr><tr><td>3750H</td><td>RX Vega 10</td><td>640:40:16 10 CU</td><td>1792.0</td><td>35 W</td><td>Jan 6, 2019</td></tr><tr><td>3700C</td><td>15 W</td><td>Sep 22, 2020</td></tr><tr><td>3700U</td><td>Jan 6, 2019</td></tr><tr><td>Ryzen 5</td><td>3580U</td><td>2.1</td><td>3.7</td><td>Vega 9</td><td>1.3</td><td>576:36:16 9 CU</td><td>1497.6</td><td>Oct 2019</td></tr><tr><td>3550H</td><td>Vega 8</td><td>1.2</td><td>512:32:8 8 CU</td><td>1228.8</td><td>35 W</td><td>Jan 6, 2019</td></tr><tr><td>3500C</td><td>15 W</td><td>Sep 22, 2020</td></tr><tr><td>3500U</td><td>Jan 6, 2019</td></tr><tr><td>3450U</td><td>3.5</td><td>Jun 2020</td></tr><tr><td>Ryzen 3</td><td>3350U</td><td>4 (4)</td><td>Vega 6</td><td>384:24:8 6 CU</td><td>921.6</td><td>Jan 6, 2019</td></tr><tr><td>3300U</td></tr></tbody></table>
Renoir (Zen 2/GCN5 based)
• Socket: FP6. • All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 16 PCIe 3.0 lanes. • Includes integrated GCN 5th generation GPU. • Fabrication process: TSMC 7FF.
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Config</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>4900H</td><td>8 (16)</td><td>3.3</td><td>4.4</td><td>8 MB</td><td>2 × 4</td><td>Radeon Graphics</td><td>1.75</td><td>512:32:8 8 CU</td><td>1792</td><td>35–54 W</td><td>Mar 16, 2020</td></tr><tr><td>4900HS</td><td>3.0</td><td>4.3</td><td>35 W</td></tr><tr><td>Ryzen 7</td><td>4800H</td><td>2.9</td><td>4.2</td><td>1.6</td><td>448:28:8 7 CU</td><td>1433.6</td><td>35–54 W</td></tr><tr><td>4800HS</td><td>35 W</td></tr><tr><td>4980U</td><td>2.0</td><td>4.4</td><td>1.95</td><td>512:32:8 8 CU</td><td>1996.8</td><td>10–25 W</td><td>Apr 13, 2021</td></tr><tr><td>4800U</td><td>1.8</td><td>4.2</td><td>1.75</td><td>1792</td><td>Mar 16, 2020</td></tr><tr><td>4700U</td><td>8 (8)</td><td>2.0</td><td>4.1</td><td>1.6</td><td>448:28:8 7 CU</td><td>1433.6</td></tr><tr><td>Ryzen 5</td><td>4600H</td><td>6 (12)</td><td>3.0</td><td>4.0</td><td>2 × 3</td><td>1.5</td><td>384:24:8 6 CU</td><td>1152</td><td>35–54 W</td></tr><tr><td>4600HS</td><td>35 W</td></tr><tr><td>4680U</td><td>2.1</td><td>448:28:8 7 CU</td><td>1344</td><td>10–25 W</td><td>Apr 13, 2021</td></tr><tr><td>4600U</td><td>384:24:8 6 CU</td><td>1152</td><td>Mar 16, 2020</td></tr><tr><td>4500U</td><td>6 (6)</td><td>2.3</td></tr><tr><td>Ryzen 3</td><td>4300U</td><td>4 (4)</td><td>2.7</td><td>3.7</td><td>4 MB</td><td>1 × 4</td><td>1.4</td><td>320:20:8 5 CU</td><td>896</td></tr></tbody></table>
Lucienne (Zen 2/GCN5 based)
• Socket: FP6. • All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 16 PCIe 3.0 lanes. • Includes integrated GCN 5th generation GPU. • Fabrication process: TSMC 7FF.
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Config</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 7</td><td>5700U</td><td>8 (16)</td><td>1.8</td><td>4.3</td><td>8 MB</td><td>2 × 4</td><td>Radeon Graphics</td><td>1.9</td><td>512:32:8 8 CU</td><td>1945.6</td><td>10–25 W</td><td>Jan 12, 2021</td></tr><tr><td>Ryzen 5</td><td>5500U</td><td>6 (12)</td><td>2.1</td><td>4.0</td><td>2 × 3</td><td>1.8</td><td>448:28:8 7 CU</td><td>1612.8</td></tr><tr><td>Ryzen 3</td><td>5300U</td><td>4 (8)</td><td>2.6</td><td>3.8</td><td>4 MB</td><td>1 × 4</td><td>1.5</td><td>384:24:8 6 CU</td><td>1152</td></tr></tbody></table>
Cezanne and Barceló (Zen 3/GCN5 based)
Cezanne (2021 models), Barceló (2022 models). Common features of Ryzen 5000 notebook APUs:
• Socket: FP6. • All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 16 PCIe 3.0 lanes. • Includes integrated GCN 5th generation GPU. • Fabrication process: TSMC 7FF.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Config</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost (Single Core)</td><td>Boost (All Core)</td></tr><tr><td>Ryzen 9</td><td>5980HX</td><td>8 (16)</td><td>3.3</td><td>4.8</td><td>4.4</td><td>16 MB</td><td>1 × 8</td><td>Radeon Graphics</td><td>2.1</td><td>512:32:8 8 CUs</td><td>2150.4</td><td>35–54 W</td><td>Jan 12, 2021</td></tr><tr><td>5980HS</td><td>3.0</td><td>4.0</td><td>35 W</td></tr><tr><td>5900HX</td><td>3.3</td><td>4.6</td><td>4.2</td><td>35–54 W</td></tr><tr><td>5900HS</td><td>3.0</td><td>4.0</td><td>35 W</td></tr><tr><td>Ryzen 7</td><td>5800H</td><td>3.2</td><td>4.4</td><td></td><td>2.0</td><td>2048</td><td>35–54 W</td></tr><tr><td>5800HS</td><td>2.8</td><td>35 W</td></tr><tr><td>5825U</td><td>2.0</td><td>4.5</td><td>15 W</td><td>Jan 4, 2022</td></tr><tr><td>5800U</td><td>1.9</td><td>4.4</td><td>3.4</td><td>10–25 W</td><td>Jan 12, 2021</td></tr><tr><td>Ryzen 5</td><td>5600H</td><td>6 (12)</td><td>3.3</td><td>4.2</td><td></td><td>1 × 6</td><td>1.8</td><td>448:28:8 7 CUs</td><td>1612.8</td><td>35–54 W</td></tr><tr><td>5600HS</td><td>3.0</td><td>35 W</td></tr><tr><td>5625U</td><td>2.3</td><td>4.3</td><td>3.6</td><td>15 W</td><td>Jan 4, 2022</td></tr><tr><td>5600U</td><td>4.2</td><td>10–25 W</td><td>Jan 12, 2021</td></tr><tr><td>5560U</td><td>4.0</td><td></td><td>8 MB</td><td>1.6</td><td>384:24:8 6 CUs</td><td>1228.8</td></tr><tr><td>5500H</td><td>4 (8)</td><td>3.3</td><td>4.2</td><td>1 × 4</td><td>1.8</td><td>1382.4</td><td>35–54 W</td><td>Jun 23, 2023</td></tr><tr><td>Ryzen 3</td><td>5425U</td><td>2.3</td><td>4.3</td><td>3.8</td><td>1.6</td><td>1228.8</td><td>15 W</td><td>Jan 4, 2022</td></tr><tr><td>5400U</td><td>2.7</td><td>4.1</td><td>10–25 W</td><td>Jan 12, 2021</td></tr><tr><td>5125C</td><td>2 (4)</td><td>3.0</td><td>—N/a</td><td>—N/a</td><td>1 × 2</td><td>1.2</td><td>192:12:8 3 CUs</td><td>460.8</td><td>15 W</td><td>May 5, 2022</td></tr></tbody></table>
Rembrandt (Zen 3+/RDNA2 based)
• Socket: FP7, FP7r2. • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 16 PCIe 4.0 lanes. • Native USB 4 (40Gbps) Ports: 2 • Native USB 3.2 Gen 2 (10Gbps) Ports: 2 • Includes integrated RDNA 2 GPU. • Fabrication process: TSMC N6 FinFET.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Config</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>6980HX</td><td>8 (16)</td><td>3.3</td><td>5.0</td><td>16 MB</td><td>1 × 8</td><td>680M</td><td>2.4</td><td>768:48:8 12 CUs</td><td>3686.4</td><td>45 W</td><td>Jan 4, 2022</td></tr><tr><td>6980HS</td><td>35 W</td></tr><tr><td>6900HX</td><td>4.9</td><td>45 W</td></tr><tr><td>6900HS</td><td>35 W</td></tr><tr><td>Ryzen 7</td><td>6800H</td><td>3.2</td><td>4.7</td><td>2.2</td><td>3379.2</td><td>45 W</td></tr><tr><td>6800HS</td><td>35 W</td></tr><tr><td>6800U</td><td>2.7</td><td>15–28 W</td></tr><tr><td>Ryzen 5</td><td>6600H</td><td>6 (12)</td><td>3.3</td><td>4.5</td><td>1 × 6</td><td>660M</td><td>1.9</td><td>384:24:8 6 CUs</td><td>1459.2</td><td>45 W</td></tr><tr><td>6600HS</td><td>35 W</td></tr><tr><td>6600U</td><td>2.9</td><td>15–28 W</td></tr></tbody></table>
Mendocino (7020 series, Zen 2/RDNA2 based)
• Socket: FT6 • All the CPUs support LPDDR5-5500 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 4 PCIe 3.0 lanes. • Native USB 4 (40Gbps) Ports: 0 • Native USB 3.2 Gen 2 (10Gbps) Ports: 1 • Includes integrated RDNA 2 GPU. • Fabrication process: TSMC N6 FinFET.
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 5</td><td>7520U</td><td>4 (8)</td><td>2.8</td><td>4.3</td><td>4 MB</td><td>1 × 4</td><td>610M 2 CU</td><td>1.9</td><td>486.4</td><td>15 W</td><td>September 20, 2022</td></tr><tr><td>Ryzen 3</td><td>7320U</td><td>2.4</td><td>4.1</td></tr></tbody></table>
Barcelo-R (7030 series, Zen 3/GCN5 based)
• Socket: FP6. • All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 16 PCIe 3.0 lanes. • Native USB 4 (40Gbps) Ports: 0 • Native USB 3.2 Gen 2 (10Gbps) Ports: 2 • Includes integrated GCN 5th generation GPU. • Fabrication process: TSMC N7 FinFET.
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 7</td><td>(PRO) 7730U</td><td>8 (16)</td><td>2.0</td><td>4.5</td><td>16 MB</td><td>1 × 8</td><td>Vega 8 CU</td><td>2.0</td><td>2048</td><td>15 W</td><td>January 4, 2023</td></tr><tr><td>Ryzen 5</td><td>(PRO) 7530U</td><td>6 (12)</td><td>1 × 6</td><td>Vega 7 CU</td><td>1792</td></tr><tr><td>7430U</td><td>2.3</td><td>4.3</td><td>1.8</td><td>1612.8</td><td>Q4 2023</td></tr><tr><td>Ryzen 3</td><td>(PRO) 7330U</td><td>4 (8)</td><td>8 MB</td><td>1 × 4</td><td>Vega 6 CU</td><td>1382.4</td><td>January 4, 2023</td></tr></tbody></table>
Rembrandt-R (7035 series, Zen 3+/RDNA2 based)
• Socket: FP7, FP7r2. • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 16 PCIe 4.0 lanes. • Native USB 4 (40Gbps) Ports: 0 • Native USB 3.2 Gen 2 (10Gbps) Ports: 2 • Includes integrated RDNA 2 GPU. • Fabrication process: TSMC N6 FinFET.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 7</td><td>7735HS</td><td>8 (16)</td><td>3.2</td><td>4.75</td><td>16 MB</td><td>1 × 8</td><td>680M 12 CU</td><td>2.2</td><td>3379.2</td><td>35–54 W</td><td>April 30, 2023</td></tr><tr><td>7735H</td></tr><tr><td>7736U</td><td>2.7</td><td>4.7</td><td>15–28 W</td><td>January 4, 2023</td></tr><tr><td>7735U</td><td>4.75</td><td>15–30 W</td></tr><tr><td>7435HS</td><td>3.1</td><td>4.5</td><td>—N/a</td><td>35–54 W</td><td>2024</td></tr><tr><td>7435H</td></tr><tr><td>Ryzen 5</td><td>7535HS</td><td>6 (12)</td><td>3.3</td><td>4.55</td><td>1 × 6</td><td>660M 6 CU</td><td>1.9</td><td>1459.2</td><td>April 30, 2023</td></tr><tr><td>7535H</td></tr><tr><td>7535U</td><td>2.9</td><td>15–30 W</td><td>January 4, 2023</td></tr><tr><td>7235HS</td><td>4 (8)</td><td>3.2</td><td>4.2</td><td>8 MB</td><td>1 × 4</td><td>—N/a</td><td>35–53 W</td><td>2024</td></tr><tr><td>7235H</td></tr><tr><td>Ryzen 3</td><td>7335U</td><td>3.0</td><td>4.3</td><td>660M 4 CU</td><td>1.8</td><td>921.6</td><td>15–30 W</td><td>January 4, 2023</td></tr></tbody></table>
Phoenix (7040 series, Zen 4/RDNA3/XDNA based)
• Socket: FP7, FP7r2, FP8. • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • All models support AVX-512 using a half-width 256-bit FPU. • PCIe 4.0 support. • Native USB 4 (40Gbps) Ports: 2 • Native USB 3.2 Gen 2 (10Gbps) Ports: 2 • Includes integrated RDNA 3 GPU. • Includes XDNA AI Engine (Ryzen AI). • Fabrication process: TSMC N4 FinFET.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>Ryzen AI</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Processing power (GFLOPS)</td></tr><tr><td>Total</td><td>Zen 4</td><td>Zen 4c</td><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>(PRO) 7940HS</td><td>8 (16)</td><td>8 (16)</td><td>—N/a</td><td>4.0</td><td>5.2</td><td>16 MB</td><td>1 × 8</td><td>780M 12 CU</td><td>2.8</td><td>4357</td><td>Yes</td><td>35-54 W</td><td>April 30, 2023</td></tr><tr><td>7940H</td></tr><tr><td>Ryzen 7</td><td>(PRO) 7840HS</td><td>3.8</td><td>5.1</td><td>2.7</td><td>4201</td></tr><tr><td>7840H</td></tr><tr><td>(PRO) 7840U</td><td>3.3</td><td>15-30 W</td><td>May 3, 2023</td></tr><tr><td>7445HS</td><td>6 (12)</td><td>2 (4)</td><td>4 (8)</td><td>3.2</td><td>4.7</td><td>2 + 4</td><td>740M 4 CU</td><td>1383</td><td>No</td><td>20-40 W</td><td></td></tr><tr><td>Ryzen 5</td><td>(PRO) 7640HS</td><td>6 (12)</td><td>6 (12)</td><td>—N/a</td><td>4.3</td><td>5.0</td><td>1 × 6</td><td>760M 8 CU</td><td>2.6</td><td>2663</td><td>Yes</td><td>35-54 W</td><td>April 30, 2023</td></tr><tr><td>7640H</td></tr><tr><td>(PRO) 7640U</td><td>3.5</td><td>4.9</td><td>15-30 W</td><td>May 3, 2023</td></tr><tr><td>(PRO) 7545U</td><td>2 (4)</td><td>4 (8)</td><td>3.7 / 3.0</td><td>4.9 / 3.5</td><td>2 + 4</td><td>740M 4 CU</td><td>2.8</td><td>1434</td><td>No</td><td></td></tr><tr><td>(PRO) 7540U</td><td>6 (12)</td><td>—N/a</td><td>3.2</td><td>4.9</td><td>1 × 6</td><td>2.5</td><td>1280</td></tr><tr><td>Ryzen 3</td><td>7440U</td><td>4 (8)</td><td>1 (2)</td><td>3 (6)</td><td>3.6 / 2.8</td><td>4.7 / 3.3</td><td>8 MB</td><td>1 + 3</td></tr></tbody></table>
Dragon Range (7045 series, Zen 4/RDNA2 based)
• Socket: FL1. • All the CPUs support DDR5-5200 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • All the CPUs support 28 PCIe 5.0 lanes. • Native USB 4 (40Gbps) Ports: 0 • Native USB 3.2 Gen 2 (10Gbps) Ports: 4 • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost). • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
<table><thead><tr><th>Branding and model</th><th>Cores (threads)</th><th>Clock (GHz)</th><th>L3 cache (total)</th><th>Chiplets</th><th>Core config</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>7945HX3D</td><td>16 (32)</td><td>2.3</td><td>5.4</td><td>128 MB</td><td>2 × CCD 1 × I/OD</td><td>2 × 8</td><td>55–75 W</td><td>July 27, 2023</td></tr><tr><td>7945HX</td><td>2.5</td><td>64 MB</td><td>February 28, 2023</td></tr><tr><td>7940HX</td><td>2.4</td><td>5.2</td><td>January 17, 2024</td></tr><tr><td>7845HX</td><td>12 (24)</td><td>3.0</td><td>5.2</td><td>2 × 6</td><td>45–75 W</td><td>February 28, 2023</td></tr><tr><td>Ryzen 7</td><td>7840HX</td><td>2.9</td><td>5.1</td><td>January 17, 2024</td></tr><tr><td>7745HX</td><td>8 (16)</td><td>3.6</td><td>5.1</td><td>32 MB</td><td>1 × CCD 1 × I/OD</td><td>1 × 8</td><td>February 28, 2023</td></tr><tr><td>Ryzen 5</td><td>7645HX</td><td>6 (12)</td><td>4.0</td><td>5.0</td><td>1 × 6</td></tr></tbody></table>
Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)
• Socket: BGA (FP7, FP7r2 or FP8 type packages). • All models support DDR5-5600 or LPDDR5X-7500 in dual-channel mode. • CPU uses Zen4 cores (Phoenix) or a combination of Zen4 and Zen4c cores (Phoenix2). • GPU uses the RDNA 3 (Navi 3) architecture. • Some models include first generation Ryzen AI NPU (XDNA). • All models support AVX-512 using a half-width 256-bit FPU. • PCIe 4.0 support. • Native USB 4 (40Gbps) Ports: 2 • Native USB 3.2 Gen 2 (10Gbps) Ports: 2 • Fabrication process: TSMC N4 FinFET.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>Ryzen AI</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Processing power (GFLOPS)</td></tr><tr><td>Total</td><td>Zen 4</td><td>Zen 4c</td><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>8945HS</td><td>8 (16)</td><td>8 (16)</td><td>—</td><td>4.0</td><td>5.2</td><td>16 MB</td><td>1 × 8</td><td>780M 12 CU</td><td>2.8</td><td>4357</td><td>Yes</td><td>35-54 W</td><td>December 6, 2023</td></tr><tr><td>Ryzen 7</td><td>8845HS</td><td>3.8</td><td>5.1</td><td>2.7</td><td>4201</td></tr><tr><td>8840HS</td><td>3.3</td><td>20-30 W</td></tr><tr><td>8840U</td><td>15-30 W</td></tr><tr><td>8745HS</td><td>3.8</td><td>4.9</td><td>2.6</td><td>4045</td><td>No</td><td>35–54 W</td><td></td></tr><tr><td>8745H</td></tr><tr><td>Ryzen 5</td><td>8645HS</td><td>6 (12)</td><td>6 (12)</td><td>4.3</td><td>5.0</td><td>1 × 6</td><td>760M 8 CU</td><td>2.6</td><td>2663</td><td>Yes</td><td>35-54 W</td><td>December 6, 2023</td></tr><tr><td>8640HS</td><td>3.5</td><td>4.9</td><td>20-30 W</td></tr><tr><td>8640U</td><td>15-30 W</td></tr><tr><td>8540U</td><td>2 (4)</td><td>4 (8)</td><td>3.7 / 3.0</td><td>4.9 / 3.5</td><td>2 + 4</td><td>740M 4 CU</td><td>2.8</td><td>1434</td><td>No</td><td></td></tr><tr><td>Ryzen 3</td><td>8440U</td><td>4 (8)</td><td>1 (2)</td><td>3 (6)</td><td>3.6 / 2.8</td><td>4.7 / 3.3</td><td>8 MB</td><td>1 + 3</td><td>2.5</td><td>1280</td></tr></tbody></table>
Dragon Range (8045 series, Zen4/RDNA2 based)
• Socket: FL1. • All the CPUs support DDR5-5200 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • All the CPUs support 28 PCIe 5.0 lanes. • Native USB 4 (40Gbps) Ports: 0 • Native USB 3.2 Gen 2 (10Gbps) Ports: 4 • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost). • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
<table><thead><tr><th>Branding and model</th><th>Cores (threads)</th><th>Clock (GHz)</th><th>L3 cache (total)</th><th>Chiplets</th><th>Core config</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>8945HX</td><td>16 (32)</td><td>2.5</td><td>5.4</td><td>64 MB</td><td>2 × CCD 1 × I/OD</td><td>2 × 8</td><td>55–75 W</td><td>April 23, 2025</td></tr><tr><td>8940HX</td><td>2.4</td><td>5.3</td></tr><tr><td>Ryzen 7</td><td>8840HX</td><td>12 (24)</td><td>2.9</td><td>5.1</td><td>2 × 6</td><td>45–75 W</td></tr><tr><td>8745HX</td><td>8 (16)</td><td>3.6</td><td>32 MB</td><td>1 × CCD 1 × I/OD</td><td>1 × 8</td></tr></tbody></table>
Fire Range (Zen 5/RDNA2 based)
• Socket: FL1 • All Models support DDR5-5600 in 128-bit mode; Maximum memory: 96 GB • All models support 28 PCIe 5.0 lanes • Native USB 10Gbps (USB 3.2 Gen 2 operation mode) : 4 • Native USB 2.0 (480 Mbit/s): 1 • iGPU: AMD Radeon 610M (2 CU @ 2200 MHz) • No NPU • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core • L2 cache: 1 MB per core • Fabrication process: TSMC N4 FinFET (CCD) + TSMC N6 FinFET (I/OD)
<table><thead><tr><th>Branding and Model</th><th>Cores (threads)</th><th>Clock (GHz)</th><th>L3 cache (total)</th><th>Chiplets</th><th>Core config</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>9955HX3D</td><td>16 (32)</td><td>2.3</td><td>5.4</td><td>128 MB</td><td>2 × CCD 1 × I/OD</td><td>2 × 8</td><td>55–75 W</td><td>1H 2025</td></tr><tr><td>9955HX</td><td>2.5</td><td>64 MB</td></tr><tr><td>9850HX</td><td>12 (24)</td><td>3.0</td><td>5.2</td><td>2 × 6</td><td>45–75 W</td></tr></tbody></table>
Mendocino (10 series, Zen 2/RDNA2 based)
• Socket: FT6 • All the CPUs support LPDDR5-5500 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 4 PCIe 3.0 lanes. • Native USB 4 (40Gbps) Ports: 0 • Native USB 3.2 Gen 2 (10Gbps) Ports: 1 • Includes integrated RDNA 2 GPU. • Fabrication process: TSMC N6 FinFET.
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Processing (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 5</td><td>40</td><td>4 (8)</td><td>2.8</td><td>4.3</td><td>4 MB</td><td>1 × 4</td><td>610M 2 CU</td><td>1.9</td><td>486.4</td><td>15 W</td><td>October 1, 2025</td></tr><tr><td>Ryzen 3</td><td>30</td><td>2.4</td><td>4.1</td></tr></tbody></table>
Rembrandt-R (100 series, Zen 3+/RDNA2 based)
• Socket: FP7, FP7r2. • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • All the CPUs support 16 PCIe 4.0 lanes. • Native USB 4 (40Gbps) Ports: 0 • Native USB 3.2 Gen 2 (10Gbps) Ports: 2 • Includes integrated RDNA 2 GPU. • Fabrication process: TSMC N6 FinFET.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 7</td><td>170</td><td>8 (16)</td><td>3.2</td><td>4.75</td><td>16 MB</td><td>1 × 8</td><td>680M 12 CU</td><td>2.2</td><td>3379.2</td><td>35–54 W</td><td>October 1, 2025</td></tr><tr><td>160</td><td>2.7</td><td>15–30 W</td></tr><tr><td>Ryzen 5</td><td>150</td><td>6 (12)</td><td>3.3</td><td>4.55</td><td>1 × 6</td><td>660M 6 CU</td><td>1.9</td><td>1459.2</td><td>35–54 W</td></tr><tr><td>130</td><td>2.9</td><td>15–30 W</td></tr><tr><td>Ryzen 3</td><td>110</td><td>4 (8)</td><td>3.0</td><td>4.3</td><td>8 MB</td><td>1 × 4</td><td>660M 4 CU</td><td>1.8</td><td>921.6</td></tr></tbody></table>
Hawk Point Refresh (200 series, Zen 4/RDNA3/XDNA based)
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>Ryzen AI</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td><td>Processing power (GFLOPS)</td></tr><tr><td>Total</td><td>Zen 4</td><td>Zen 4c</td><td>Base</td><td>Boost</td></tr><tr><td>Ryzen 9</td><td>270</td><td>8 (16)</td><td>8 (16)</td><td>—N/a</td><td>4.0</td><td>5.2</td><td>16 MB</td><td>1 × 8</td><td>780M 12 CU</td><td>2.8</td><td>4357</td><td>Yes</td><td>35–54 W</td><td>Q2 2025</td></tr><tr><td>Ryzen 7</td><td>260</td><td>3.8</td><td>5.1</td><td>2.7</td><td>4201</td></tr><tr><td>(PRO) 250</td><td>3.3</td><td>15–30 W</td></tr><tr><td>Ryzen 5</td><td>240</td><td>6 (12)</td><td>6 (12)</td><td>4.3</td><td>5.0</td><td>1 × 6</td><td>760M 8 CU</td><td>2.6</td><td>2663</td><td>35–54 W</td></tr><tr><td>(PRO) 230</td><td>3.5</td><td>4.9</td><td>15–30 W</td></tr><tr><td>(PRO) 220</td><td>2 (4)</td><td>4 (8)</td><td>3.7 / 3.0</td><td>4.9 / 3.5</td><td>2 + 4</td><td>740M 4 CU</td><td>2.8</td><td>1434</td><td>No</td></tr><tr><td>Ryzen 3</td><td>(PRO) 210</td><td>4 (8)</td><td>1 (2)</td><td>3 (6)</td><td>3.6 / 2.8</td><td>4.7 / 3.3</td><td>8 MB</td><td>1 + 3</td><td>2.5</td><td>1280</td></tr></tbody></table>
Strix Point and Krackan Point (Zen 5/RDNA3.5/XDNA2 based)
• Socket: BGA, FP8 package type. • All models support DDR5-5600 or LPDDR5X-8000 in dual-channel mode. • All models support 16 PCIe 4.0 lanes. • Native USB4 (40Gbps) Ports: 2 • Native USB 3.2 Gen 2 (10Gbps) Ports: 2 • iGPU uses the RDNA 3.5 microarchitecture. • NPU uses the XDNA 2 AI Engine (Ryzen AI). • Both Zen 5 and Zen 5c cores support AVX-512 using a half-width 256-bit FPU. • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • Fabrication process: TSMC N4P FinFET.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>NPU (Ryzen AI)</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock (GHz)</td><td>L3 cache (total)</td><td>Model</td><td>Clock (GHz)</td></tr><tr><td>Total</td><td>Zen 5</td><td>Zen 5c</td><td>Base</td><td>Boost (Zen 5)</td><td>Boost (Zen 5c)</td></tr><tr><td>Ryzen AI 9</td><td>(PRO) HX 375</td><td>12 (24)</td><td>4 (8)</td><td>8 (16)</td><td>2.0</td><td>5.1</td><td>3.3</td><td>24 MB</td><td>890M 16 CUs</td><td>2.9</td><td>55 TOPS</td><td>15–54 W</td><td>June 2, 2024</td></tr><tr><td>(PRO) HX 370</td><td>50 TOPS</td></tr><tr><td>365</td><td>10 (20)</td><td>6 (12)</td><td>5.0</td><td>880M 12 CUs</td></tr><tr><td>Ryzen AI 7</td><td>PRO 360</td><td>8 (16)</td><td>3 (6)</td><td>5 (10)</td><td>16 MB</td><td>October 10, 2024</td></tr><tr><td>(PRO) 350</td><td>4 (8)</td><td>4 (8)</td><td>3.5</td><td>860M 8 CU</td><td>3.0</td><td>Q1 2025</td></tr><tr><td>Ryzen AI 5</td><td>(PRO) 340</td><td>6 (12)</td><td>3 (6)</td><td>3 (6)</td><td>4.8</td><td>3.4</td><td>840M 4 CU</td><td>2.9</td></tr><tr><td>330</td><td>4 (8)</td><td>1 (2)</td><td>4.5</td><td>8 MB</td><td>820M 2 CU</td><td>2.8</td><td>15–28 W</td><td>July 2025</td></tr></tbody></table>
Strix Halo (Zen 5/RDNA3.5/XDNA2 based)
<table><thead><tr><th>Branding and Model</th><th>CPU</th><th>GPU</th><th>Memory</th><th>NPU (Ryzen AI)</th><th>Chiplets</th><th>Core config</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock (GHz)</td><td>L3 cache (total)</td><td>Model</td><td>Clock (GHz)</td><td>Bus type & width (Max memory)</td><td>Clock (MT/s)</td><td>Bandwidth (GB/s)</td></tr><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen AI MAX+</td><td>(PRO) 395</td><td>16 (32)</td><td>3.0</td><td>5.1</td><td>64 MB</td><td>8060S 40 CUs</td><td>2.9</td><td>LPDDR5X 256-bit (128 GB)</td><td>Up to 8000</td><td>Up to 256</td><td>50 TOPS</td><td>2 × CCD 1 × I/OD with GPU</td><td>2 × 8</td><td>45–120 W</td><td>Q1 2025</td></tr><tr><td>392</td><td>12 (24)</td><td>3.2</td><td>5.0</td><td>2 × 6</td><td>Q1 2026</td></tr><tr><td>Ryzen AI MAX</td><td>(PRO) 390</td><td>8050S 32 CUs</td><td>2.8</td><td>Q1 2025</td></tr><tr><td>Ryzen AI MAX+</td><td>388</td><td>8 (16)</td><td>3.6</td><td>32 MB</td><td>8060S 40 CUs</td><td>2.9</td><td>1 × CCD 1 × I/OD with GPU</td><td>1 × 8</td><td>Q1 2026</td></tr><tr><td>Ryzen AI MAX</td><td>(PRO) 385</td><td>8050S 32 CUs</td><td>2.8</td><td>Q1 2025</td></tr><tr><td>PRO 380</td><td>6 (12)</td><td>4.9</td><td>16 MB</td><td>8040S 16 CUs</td><td>LPDDR5X 128-bit (64 GB)</td><td>Up to 128</td><td>1 × 6</td></tr></tbody></table>
Gorgon Point (Zen 5/RDNA3.5/XDNA2 based)
• Socket: BGA, FP8 package type. • All models support DDR5-5600 or LPDDR5X-8000 (LPDDR5X-8533 for 440, 450, 465, 470, 475 series) in dual-channel mode. • All models support 16 PCIe 4.0 lanes. • Native USB4 (40Gbps) Ports: 2 • Native USB 3.2 Gen 2 (10Gbps) Ports: 2 • iGPU uses the RDNA 3.5 microarchitecture. • NPU uses the XDNA 2 AI Engine (Ryzen AI). • Both Zen 5 and Zen 5c cores support AVX-512 using a half-width 256-bit FPU. • L1 cache: 80 KB (48 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • Fabrication process: TSMC N4P FinFET.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>NPU (Ryzen AI)</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock (GHz)</td><td>L3 cache (total)</td><td>Model</td><td>Clock (GHz)</td></tr><tr><td>Total</td><td>Zen 5</td><td>Zen 5c</td><td>Base</td><td>Boost (Zen 5)</td><td>Boost (Zen 5c)</td></tr><tr><td>Ryzen AI 9</td><td>(PRO) HX 475</td><td>12 (24)</td><td>4 (8)</td><td>8 (16)</td><td>2.0</td><td>5.2</td><td>3.3</td><td>24 MB</td><td>890M 16 CUs</td><td>3.1</td><td>60 TOPS</td><td>15–54 W</td><td>January 5, 2026</td></tr><tr><td>(PRO) HX 470</td><td>55 TOPS</td></tr><tr><td>(PRO) 465</td><td>10 (20)</td><td>6 (12)</td><td>5.0</td><td>880M 12 CUs</td><td>2.9</td><td>50 TOPS</td></tr><tr><td>Ryzen AI 7</td><td>(PRO) 450</td><td>8 (16)</td><td>4 (8)</td><td>4 (8)</td><td>5.1</td><td>3.6</td><td>16 MB</td><td>860M 8 CUs</td><td>3.1</td></tr><tr><td>445</td><td>6 (12)</td><td>2 (4)</td><td>4.6</td><td>3.5</td><td>8 MB</td><td>840M 4 CUs</td><td>2.9</td></tr><tr><td>Ryzen AI 5</td><td>PRO 440</td><td>3 (6)</td><td>3 (6)</td><td>4.8</td><td>16 MB</td></tr><tr><td>(PRO) 435</td><td>2 (4)</td><td>4 (8)</td><td>4.5</td><td>3.4</td><td>8 MB</td><td>2.8</td></tr><tr><td>430</td><td>4 (8)</td><td>1 (2)</td><td>3 (6)</td><td>15–28 W</td></tr></tbody></table>
Handheld gaming PC processors
Ryzen Z1 series (Zen 4/RDNA3 based)
• Socket: FP7, FP7r2, FP8. • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • All the CPUs support 20 PCIe 4.0 lanes. • Includes integrated RDNA 3 GPU. • Fabrication process: TSMC 4 nm FinFET.
<table><thead><tr><th>Branding and model</th><th>CPU</th><th>GPU</th><th>Default TDP</th><th>Configurable TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Model</td><td>Clock (GHz)</td></tr><tr><td>Total</td><td>Zen 4</td><td>Zen 4c</td><td>Base</td><td>Boost</td></tr><tr><td>Ryzen</td><td>Z1 Extreme</td><td>8 (16)</td><td>8 (16)</td><td>—N/a</td><td>3.3</td><td>5.1</td><td>16 MB</td><td>1 × 8</td><td>AMD Radeon Graphics RDNA 3 12 CU</td><td>2.9</td><td>28 W</td><td>9–30 W</td><td>May 2023</td></tr><tr><td>Z1</td><td>6 (12)</td><td>2 (4)</td><td>4 (8)</td><td>3.2 (average) 3.7 (Zen 4) 3 (Zen 4c)</td><td>4.9 (Zen 4) 3.5 (Zen 4c)</td><td>2 + 4</td><td>AMD Radeon Graphics RDNA 3 4 CU</td><td>2.8</td></tr></tbody></table>
Ryzen Z2 series (multiple architectures)
<table><thead><tr><th>Branding and Model</th><th>Codename</th><th>Process</th><th>CPU</th><th>GPU</th><th>NPU (Ryzen AI)</th><th>Default TDP</th><th>Configurable TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock (GHz)</td><td>L3 cache (total)</td><td>Core config</td><td>Architecture</td><td>Compute units</td><td>Clock (GHz)</td></tr><tr><td>Total</td><td>Zen 2/3+/4/5</td><td>Zen 5c</td><td>Base</td><td>Boost</td></tr><tr><td>Ryzen AI</td><td>Z2 Extreme</td><td>Strix Point</td><td>TSMC 4 nm</td><td>8 (16)</td><td>3 (6) (Zen 5)</td><td>5 (10) (Zen 5c)</td><td>2.0</td><td>5.0 / 3.3</td><td>16 MB</td><td>3 + 5</td><td>RDNA3.5</td><td>16</td><td>2.9</td><td>50 TOPS</td><td>28 W</td><td>15–35 W</td><td>June 2025</td></tr><tr><td>Ryzen</td><td>Z2 Extreme</td><td>—N/a</td><td>Q1 2025</td></tr><tr><td>Z2</td><td>Hawk Point</td><td>TSMC 4 nm</td><td>8 (16) (Zen 4)</td><td>—N/a</td><td>3.3</td><td>5.1</td><td>1 × 8</td><td>RDNA3</td><td>12</td><td>2.7</td><td>15–30 W</td></tr><tr><td>Z2 Go</td><td>Rembrandt+</td><td>TSMC 6 nm</td><td>4 (8)</td><td>4 (8) (Zen 3+)</td><td>3.0</td><td>4.3</td><td>8 MB</td><td>1 × 4</td><td>RDNA2</td><td>12</td><td>2.2</td></tr><tr><td>Z2 A</td><td>Van Gogh</td><td>TSMC 7 nm</td><td>4 (8) (Zen 2)</td><td>2.8</td><td>3.8</td><td>4 MB</td><td>8</td><td>1.8</td><td>15 W</td><td>6–20 W</td><td>June 2025</td></tr></tbody></table>
Embedded processors
Great Horned Owl (V1000 series, Zen/GCN5 based)
<table><thead><tr><th>Model</th><th>Release date</th><th>Fab</th><th>CPU</th><th>GPU</th><th>Memory support</th><th>TDP</th><th>Junction temp. range (°C)</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>Cache</td><td>Model</td><td>Config</td><td>Clock (GHz)</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td><td>L1</td><td>L2</td><td>L3</td></tr><tr><td>V1202B</td><td>February 2018</td><td>GloFo 14LP</td><td>2 (4)</td><td>2.3</td><td>3.2</td><td>64 KB inst. 32 KB data per core</td><td>512 KB per core</td><td>4 MB</td><td>Vega 3</td><td>192:12:16 3 CU</td><td>1.0</td><td>384</td><td>DDR4-2400 dual-channel</td><td>12–25 W</td><td>0–105</td></tr><tr><td>V1404I</td><td>December 2018</td><td>4 (8)</td><td>2.0</td><td>3.6</td><td>Vega 8</td><td>512:32:16 8 CU</td><td>1.1</td><td>1126.4</td><td>-40–105</td></tr><tr><td>V1500B</td><td>2.2</td><td>—N/a</td><td>—N/a</td><td>0–105</td></tr><tr><td>V1605B</td><td>February 2018</td><td>2.0</td><td>3.6</td><td>Vega 8</td><td>512:32:16 8 CU</td><td>1.1</td><td>1126.4</td></tr><tr><td>V1756B</td><td>3.25</td><td>DDR4-3200 dual-channel</td><td>35–54 W</td></tr><tr><td>V1780B</td><td>December 2018</td><td>3.35</td><td>—N/a</td></tr><tr><td>V1807B</td><td>February 2018</td><td>3.8</td><td>Vega 11</td><td>704:44:16 11 CU</td><td>1.3</td><td>1830.4</td></tr></tbody></table>
Banded Kestrel (R1000 series, Zen/GCN5 based)
<table><thead><tr><th>Model</th><th>Release date</th><th>Fab</th><th>CPU</th><th>GPU</th><th>Memory support</th><th>TDP</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>Cache</td><td>Model</td><td>Config</td><td>Clock (GHz)</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td><td>L1</td><td>L2</td><td>L3</td></tr><tr><td>R1102G</td><td>February 25, 2020</td><td>GloFo 14LP</td><td>2 (2)</td><td>1.2</td><td>2.6</td><td>64 KB inst. 32 KB data per core</td><td>512 KB per core</td><td>4 MB</td><td>Vega 3</td><td>192:12:4 3 CU</td><td>1.0</td><td>384</td><td>DDR4-2400 single-channel</td><td>6 W</td></tr><tr><td>R1305G</td><td>2 (4)</td><td>1.5</td><td>2.8</td><td>DDR4-2400 dual-channel</td><td>8-10 W</td></tr><tr><td>R1505G</td><td>April 16, 2019</td><td>2.4</td><td>3.3</td><td>12–25 W</td></tr><tr><td>R1606G</td><td>2.6</td><td>3.5</td><td>1.2</td><td>460.8</td></tr></tbody></table>
Grey Hawk (V2000 series, Zen 2/GCN5 based)
<table><thead><tr><th>Model</th><th>Release date</th><th>Fab</th><th>CPU</th><th>GPU</th><th>Socket</th><th>PCIe support</th><th>Memory support</th><th>TDP</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>Cache</td><td>Archi- tecture</td><td>Config</td><td>Clock (GHz)</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td><td>L1</td><td>L2</td><td>L3</td></tr><tr><td>V2516</td><td>Nov 10, 2020</td><td>TSMC 7FF</td><td>6 (12)</td><td>2.1</td><td>3.95</td><td>32 KB inst. 32 KB data per core</td><td>512 KB per core</td><td>8 MB</td><td>GCN 5</td><td>384:24:8 6 CU</td><td>1.5</td><td>1152</td><td>FP6</td><td>20 (8+4+4+4) PCIe 3.0</td><td>DDR4-3200 dual-channel LPDDR4X-4266 quad-channel</td><td>10–25 W</td></tr><tr><td>V2546</td><td>3.0</td><td>3.95</td><td>35–54 W</td></tr><tr><td>V2A46</td><td>Jan 4, 2023</td><td>3.2</td><td>448:28:8 7 CU</td><td>1.6</td><td>1433.6</td></tr><tr><td>V2718</td><td>Nov 10, 2020</td><td>8 (16)</td><td>1.7</td><td>4.15</td><td>10–25 W</td></tr><tr><td>V2748</td><td>2.9</td><td>4.25</td><td>35–54 W</td></tr></tbody></table>
River Hawk (R2000 series, Zen+ based)
<table><thead><tr><th>Model</th><th>Release date</th><th>Fab</th><th>CPU</th><th>GPU</th><th>Socket</th><th>PCIe support</th><th>Memory support</th><th>TDP</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>Cache</td><td>Archi- tecture</td><td>Config</td><td>Clock (GHz)</td><td>Processing power (GFLOPS)</td></tr><tr><td>Base</td><td>Boost</td><td>L1</td><td>L2</td><td>L3</td></tr><tr><td>R2312</td><td>June 7, 2022</td><td>GloFo 12LP</td><td>2 (4)</td><td>2.7</td><td>3.5</td><td>64 KB inst. 32 KB data per core</td><td>512 KB per core</td><td>4 MB</td><td>GCN 5</td><td>192:12:4 3 CU</td><td>1.2</td><td>460.8</td><td>FP5</td><td>8 lanes Gen 3</td><td>DDR4-2400 dual-channel ECC</td><td>10–25 W</td></tr><tr><td>R2314</td><td>4 (4)</td><td>2.1</td><td>384:24:8 6 CU</td><td>921.6</td><td>16 lanes Gen 3</td><td>DDR4-2666 dual-channel ECC</td><td>10–35 W</td></tr></tbody></table>
(V3000 series, Zen 3 based)
<table><thead><tr><th>Model</th><th>Release date</th><th>Fab</th><th>CPU</th><th>Socket</th><th>PCIe support</th><th>Memory support</th><th>TDP</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Clock rate (GHz)</td><td>Cache</td></tr><tr><td>Base</td><td>Boost</td><td>L1</td><td>L2</td><td>L3</td></tr><tr><td>V3C14</td><td>September 27, 2022</td><td>TSMC 7FF</td><td>4 (8)</td><td>2.3</td><td>3.8</td><td>32 KB inst. 32 KB data per core</td><td>512 KB per core</td><td>8 MB</td><td>FP7r2</td><td>20 (8+4+4+4) PCIe 4.0</td><td>DDR5-4800 dual-channel</td><td>15 W</td></tr><tr><td>V3C44</td><td>3.5</td><td>3.8</td><td>45 W</td></tr><tr><td>V3C16</td><td>6 (12)</td><td>2.0</td><td>3.8</td><td>16 MB</td><td>15 W</td></tr><tr><td>V3C18I</td><td>8 (16)</td><td>1.9</td><td>3.8</td><td>15 W</td></tr><tr><td>V3C48</td><td>3.3</td><td>3.8</td><td>45 W</td></tr></tbody></table>
(Ryzen Embedded 5000 series, Zen 3 based)
Common features of Ryzen Embedded 5000 series CPUs:
• Socket: AM4. • All the CPUs support ECC DDR4-3200 dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 512 KB per core. • No integrated graphics. • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset. • Fabrication process: TSMC 7FF.
<table><thead><tr><th>Processor branding</th><th>Model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>Chiplets</th><th>Core config</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen Embedded</td><td>5950E</td><td>16 (32)</td><td>3.05</td><td>3.4</td><td>64 MB</td><td>2 × CCD 1 × I/OD</td><td>2 × 8</td><td>105 W</td><td>Apr 20, 2023</td></tr><tr><td>5900E</td><td>12 (24)</td><td>3.35</td><td>3.7</td><td>2 × 6</td></tr><tr><td>5800E</td><td>8 (16)</td><td>3.4</td><td>32 MB</td><td>1 × CCD 1 × I/OD</td><td>1 × 8</td><td>65-100 W</td></tr><tr><td>5600E</td><td>6 (12)</td><td>3.3</td><td>3.6</td><td>1 × 6</td><td>65 W</td></tr></tbody></table>
(Ryzen Embedded 7000 series, Zen 4/RDNA2 based)
Common features of Ryzen Embedded 7000 series CPUs:
• Socket: AM5. • All the CPUs support ECC DDR5-5200 dual-channel mode. • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. • L2 cache: 1 MB per core. • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset. • Includes integrated RDNA 2 GPU with 2 CUs and boost clock speeds of 2200 MHz. • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
<table><thead><tr><th>Processor branding</th><th>Model</th><th>Cores (threads)</th><th>Clock rate (GHz)</th><th>L3 cache (total)</th><th>Chiplets</th><th>Core config</th><th>TDP</th><th>Release date</th></tr></thead><tbody><tr><td>Base</td><td>Boost</td></tr><tr><td>Ryzen Embedded</td><td>7945</td><td>12 (24)</td><td>3.7</td><td>5.4</td><td>64 MB</td><td>2 × CCD 1 × I/OD</td><td>2 × 6</td><td>65 W</td><td>Nov 14, 2023</td></tr><tr><td>7745</td><td>8 (16)</td><td>3.8</td><td>5.3</td><td>32 MB</td><td>1 × CCD 1 × I/OD</td><td>1 × 8</td></tr><tr><td>7700X</td><td>4.5</td><td>5.4</td><td>105 W</td></tr><tr><td>7645</td><td>6 (12)</td><td>3.8</td><td>5.1</td><td>1 × 6</td><td>65 W</td></tr><tr><td>7600X</td><td>4.7</td><td>5.3</td><td>105 W</td></tr></tbody></table>
(Ryzen AI Embedded P100 series, Zen 5/RDNA 3.5 based)
Model numbers with the "i" suffix are marketed for industrial use and support operating at colder ambient temperatures. Model numbers with the "a" suffix are marketed for automotive use and are AEC-Q100 qualified for reliability and longevity.
Common features of Ryzen AI Embedded P100 series CPUs:
• Socket: BGA, FP8 package type. • L3 cache (total): 8 MB. • All models support dual-channel ECC DRAM. • All models support 14 PCIe 4.0 lanes. • Native 10GbE ports (with TSN): 2 • Native USB 5Gbps (USB 3.2 Gen 1 operation mode): 1 • Native USB 5Gbps (USB 3.1 Gen 1 operation mode): 1 • Native USB 2.0 (480 Mbit/s): 4 • iGPU uses the RDNA 3.5 microarchitecture and supports output at up to 120 FPS to up to either 4 × 4K or 2 × 8K displays. • iGPU supports encoding/decoding video at up to 4K & 60 Hz. • All iGPUs support HDMI 2.1 and DisplayPort 2.0 output. • NPU uses the XDNA 2 architecture. • Rated longevity: "2.5 years (Standard), Up to 10 years (Extended)"
<table><thead><tr><th>Processor branding</th><th>Model</th><th>CPU</th><th>GPU</th><th>Memory support</th><th>NPU TOPS</th><th>USB4 ports</th><th>Nominal TDP</th><th>Configurable TDP</th><th>Junction temperature range</th><th>Release date</th></tr></thead><tbody><tr><td>Cores (threads)</td><td>Boost clock (GHz)</td><td>L2 cache (total)</td><td>CU</td><td>Clock (GHz)</td><td>eDP version</td></tr><tr><td>Ryzen AI Embedded</td><td>P132i</td><td>6 (12)</td><td>4.5</td><td>6 MB</td><td>4</td><td>2.8</td><td>1.4</td><td>LPDDR5X-8000 DDR5-5600</td><td>50</td><td>2</td><td>28 W</td><td>15–54 W</td><td>−40 °C – 105 °C</td><td>Q2 2026</td></tr><tr><td>P132</td><td>0 °C – 105 °C</td></tr><tr><td>P132a</td><td>3.7</td><td>4 MB</td><td>2.4</td><td>1.5</td><td>LPDDR5X-7500 with RAS</td><td>No</td><td>45 W</td><td>25–45 W</td><td>−40 °C – 105 °C</td></tr><tr><td>P121i</td><td>4 (8)</td><td>4.4</td><td>4 MB</td><td>2</td><td>2.7</td><td>1.4</td><td>LPDDR5X-7500 DDR5-5600</td><td>30</td><td>2</td><td>28 W</td><td>15–54 W</td><td>−40 °C – 105 °C</td></tr><tr><td>P121</td><td>0 °C – 105 °C</td></tr><tr><td>P122a</td><td>3.7</td><td>4</td><td>2.0</td><td>1.6</td><td>LPDDR5X-7500 with RAS</td><td>No</td><td>15–30 W</td><td>−40 °C – 105 °C</td></tr></tbody></table>